Printed Circuit Board Assembly

Printed Circuit Board Assembly
High-Density, Advanced Technology Products

CMC helps create outsourcing programs for printed circuit board assembly, mechanical sub-assemblies and end-products that give our clients important competitive advantages. 

We have particular expertise with printed circuit board assembly for high-end computing, communications and other advanced technology products.

These printed circuit boards are highly complex with many fine-pitch devices and package types, IC’s on top and bottom, etc. and therefore are difficult to manufacturer with consistently high first-pass assembly yields.

Printed circuit board assembly of these boards require the stringent control of line set-ups, solder paste application, reflow profiling and other key processes.

Also required are advanced engineering capabilities in functional test and burn-in. 

Particularly important for off-shore printed circuit board assembly of advance technology products is expert board-level failure diagnostics and defect repair.


Not all EMS provides have proven capabilities for printed circuit board assembly of advanced technology products. 

For example, we recently completed a survey and comparative assessment of 16 telecom printed circuit board assembly sites in Mexico, China and SE Asia for a $500 million telecom infrastructure company that showed wide variation in-process yields and other performance factors.

Lower printed circuit board assembly first-pass yields result in less reliable manual solder joints, greater bare board damage risk and longer production cycle time.

The impact on the OEM is missed end-product deliveries and higher field failures -adversely impacting its reputation and competitive position.